A robotic workcell assembled from many interlocking industrial components

The Integration Layer

The largest robotics opportunity may not be a more human machine, but a cheaper path from an empty factory floor to reliable production.

A researcher holds a photonic integrated chip packaged for extreme environments. Photo: M. King / NIST.

The Package Is the Computer

AI hardware is turning semiconductor packaging from an afterthought into the place where systems are designed, constrained and won.